Optimizing pre-bond and post-bond test time for three dimension IP cores
LIU Jun1,2, QIAN Qingqing1,2, WU Xi1,2, WANG Wei1,2, CHEN Tian1,2, REN Fuji3
1.School of Computer and Information, Hefei University of Technology, Hefei 230009, China
2.Anhui Province Key Laboratory of Affective Computing and Advanced Intelligent Machine, Hefei 230009, China
3.Department of Information Science & Intelligent Systems, Faculty of Engineering, The University of Tokushima, Tokushima 7708502, Japan
LIU Jun1,2, QIAN Qingqing1,2, WU Xi1,2, WANG Wei1,2, CHEN Tian1,2, REN Fuji3. Optimizing pre-bond and post-bond test time for three dimension IP cores[J]. Computer Engineering and Applications, 2016, 52(22): 44-48.