计算机工程与应用 ›› 2008, Vol. 44 ›› Issue (5): 246-248.

• 工程与应用 • 上一篇    

超塑性微挤压装置温度控制系统研究

孙振锋,齐乐华,毛 军,杨 方   

  1. 西北工业大学 机电学院,西安 710072
  • 收稿日期:2007-07-09 修回日期:2007-10-17 出版日期:2008-02-11 发布日期:2008-02-11
  • 通讯作者: 孙振锋

Research on temperature control system of superplastic micro-extrusion device

SUN Zhen-feng,QI Le-hua,MAO Jun,YANG Fang   

  1. School of Mechatronic,Northwest Polytechnical University,Xi’an 710072
  • Received:2007-07-09 Revised:2007-10-17 Online:2008-02-11 Published:2008-02-11
  • Contact: SUN Zhen-feng

摘要: 针对研制超塑性微挤压装置中存在的温度控制对象大延迟特性,将PI Smith预估控制算法应用于该装置的温度控制系统中,在MATLAB/Smulink环境下,结合快速原型开发概念,实现对温度参数的模型辨识和实时控制。温度控制系统由工控机与PCI-1710多功能数据采集卡组成,通过PWM调功输出实现恒温控制。温度控制实验表明,控制精度在±0.5℃范围以内,可以满足超塑性微挤压装置的温度控制精度。

Abstract: In the designing of superplastic micro-extrusion device,this paper applied a PI Smith predictor to the temperature control system for its time-delay characteristic.Based on the rapid prototyping instruction,the model identification control strategy of temperature parameter was realized in the MATLAB/Simulink environment.The temperature control system was composed of industrial control computer and data acquisition card PCI-1710.The power out was controlled by PWM method.The result of temperature control in experiment shows that the control precision is in the range of ±0.5℃,it can satisfy the design target.