Computer Engineering and Applications ›› 2007, Vol. 43 ›› Issue (17): 100-103.

• 产品、研发、测试 • Previous Articles     Next Articles

Placement optimization of electronic components based on genetic algorithm

ZHU Guo-xi,LIU Gui-xi,ZHAO Di   

  1. Department of Automation,Xidian University,Xi’an 710071,China
  • Received:1900-01-01 Revised:1900-01-01 Online:2007-06-11 Published:2007-06-11
  • Contact: ZHU Guo-xi

基于遗传算法的电子元器件优化布局

朱国玺,刘贵喜,赵 地   

  1. 西安电子科技大学 自动控制系,西安 710071
  • 通讯作者: 朱国玺

Abstract: The model for temperature field of electronic components in the printed circuit board has been given using the thermal equation of microelement units.Gauss-Seidel iterative technique has been employed to solve the linear equations set.With the use of an improved Genetic Algorithm(GA),the optimal placement of the electronic components has been obtained.The simulation results show the temperature stress is reduced and the reliability is improved greatly.In additional,the steady temperature field of the components in PCB has been also analyzed with the thermal analysis software.The results show the model and algorithm for optimizing the components layout are effective.

Key words: Genetic Algorithm, thermal equations of microelement units, Gauss-Seidel iterative method, placement optimization

摘要: 用微元体热平衡法建立电路板上元件温度场求解的数学模型,采用高斯-赛德尔迭代法求解热平衡方程组。用改进的遗传算法对元件布局进行优化设计,仿真实验表明全局优化大大降低了系统的温度应力,提高了系统的可靠性。此外,用Flotherm软件模拟了电路板的温度场,验证了优化布局模型和算法的有效性。

关键词: 遗传算法, 微元体热平衡方程, 高斯-赛德尔迭代法, 优化布局